Weight & dimensions | |
Width | 67.6 mm |
Height | 30 mm |
Operational conditions | |
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Packaging data | |
Package type | SO-DIMM |
Other features | |
Chips organisation | X8 |
Bus clock rate | 1600 MHz |
Error indication | No |
Memory layout | 1 x 4096 MB |
Internal memory | 4096 MB |
Features | |
Internal memory | 4 GB |
Memory layout (modules x size) | 1 x 4 GB |
Internal memory type | DDR3 |
Memory clock speed | 1600 MHz |
Component for | Laptop |
Memory form factor | 204-pin SO-DIMM |
ECC | No |
Buffered memory type | Unregistered (unbuffered) |
CAS latency | 11 |
Memory bus | 64 bit |
Memory ranking | 1 |
Memory voltage | 1.5 V |
Module configuration | 512M X 64 |
Row cycle time | 48.125 ns |
Refresh row cycle time | 260 ns |
Row active time | 35 ns |
Country of origin | Taiwan |
Lead plating | Gold |
Logistics data | |
Harmonized System (HS) code | 84733020 |