BREAK-THROUGH IN HEAT TRANSFER The contact with CPU and heat transfer has been improved with an entire block of Heat Column for thermal conductivity and phase transition. This revoluationary design enables low profile design to reach TDP of 130W that matches peformance of regular sized heatsinks. 7X Larger Diamater than Heatpipes Super quick heat transfer is made possible with Heat Column at a massive Ø41.2, the equivalent of 7X the size of traditional heatpipes. The unification of heatpipes and base into one unit captures and effiicienty transfers the heat from CPU like never seen before. Low Profile for Mini-ITX Builds The low profile G100M stands at 74.5mm, a great fit for slim PC cases, including mini-ITX cases. Even at these small dimensions, the heatsink has cooling capacity of 130W TDP. RGB LED Illumination (Controller Included) A wired RGB LED controller is included with theM100M to personalize the RGB lighting anytime you want (no software needed). Switch it up depending on your mood, the possibilities are not limitless. TOP DOWN AIR FLOW PERFORMANCE A high peformance 92mm PWM fan with a range of 600 ~ 2400 RPM, cools not only the CPU, but all surrounding components inside the case for exceptional thermal results. Quick and Easy Installation Tool-free mounting kit makes installation a breeze. Universal retention brackets are included, with full compatbiliity for: Intel® LGA 2066 / 2011-v3 / 2011 / 1151 / 1150 / 1155 / 1156 / 1366 / 775 AMD® AM4 / AM3+ / AM3 / AM2+ / AM2 / FM2+ / FM2 / FM1

Weight & dimensions
Weight	380 g
Fan dimensions (W x D x H)	145 x 154 x 74.5 mm
Heatsink weight	320 g
Package width	168 mm
Package depth	168 mm
Package height	108 mm
Package weight	520 g
Power
Power consumption (typical)	4.08 W
Other features
Heatsink dimensions (W x D x H)	143 x 143 x 51.7 mm
Noise level	30 dB
Mean time to failure (MTTF)	280000 h
Design
Product colour	Black
Illumination LED	Y
Illumination colour	Multi
Fan connector	4-pin
Performance
Suitable location	Processor
Type	Cooler
Fan diameter	10 cm
Supported processor sockets	LGA 1151 (Socket H4), LGA 1155 (Socket H2), LGA 1156 (Socket H), LGA 1366 (Socket B), LGA 2011 (Socket R), LGA 2011-v3 (Socket R), LGA 2066, LGA 775 (Socket T), Socket AM2, Socket AM2+, Socket AM3, Socket AM3+, Socket AM4, Socket FM1, Socket FM2, Socket FM2+
Rotational speed (min)	600 RPM
Rotational speed (max)	2400 RPM
Maximum airflow	22.63 cfm
Maximum air pressure	1.6 mmH2O
Pulse-width modulation (PWM) support	Y
Logistics data
Harmonized System (HS) code	84733080
Master (outer) case width	355 mm
Master (outer) case length	529 mm
Master (outer) case height	250 mm
Products per master (outer) case	12 pc(s)